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A PCB Packaging Platform Enabling 100+ Gbaud Optoelectronic Device Testing

Submitted by jgtao on Tue, 10/05/2021 - 15:32

TitleA PCB Packaging Platform Enabling 100+ Gbaud Optoelectronic Device Testing
Publication TypeConference Paper
Year of Publication2021
AuthorsMaharry, Aaron, Valenzuela Luis A., Buckwalter James F., and Schow Clint L.
Conference Name2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
DOI10.1109/ECTC32696.2021.00214
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