Found 19 results
Author Title Type [ Year
Filters: First Letter Of Last Name is C [Clear All Filters]
A 50 Gbps 9.5 pJ/bit VCSEL-based Optical Link,
, 2021 IEEE Photonics Conference (IPC), p.1-2, (2021)
A 50 Gbps 9.5 pJ/bit VCSEL-based Optical Link,
, 2021 IEEE Photonics Conference (IPC), p.1-2, (2021)
Analog Coherent Detection for Energy Efficient Intra-Data Center Links at 200 Gbps Per Wavelength,
, Journal of Lightwave Technology, Volume 39, Number 2, p.520-531, (2021)
185mW InP HBT Power Amplifier with 1 Octave Bandwidth (2550GHz), 38% peak PAE at 44GHz and Chip Area of 276 x 672 ?m2,
, 2019 IEEE MTT-S International Microwave Symposium (IMS), June, p.1303-1305, (2019)
Forward bias operation of silicon photonic Mach Zehnder modulators for RF applications,
, Optics express, Volume 25, Number 19, p.23181–23190, (2017)
Forward bias optimization of a silicon photonic modulator for analog application,
, 2017 IEEE Avionics and Vehicle Fiber-Optics and Photonics Conference (AVFOP), p.47–48, (2017)
A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer,
, Optics express, Volume 22, Number 10, p.12289–12295, (2014)
Energy efficiency optimization through codesign of the transmitter and receiver in high-speed on-chip interconnects,
, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Volume 22, Number 4, p.938–942, (2013)
Modeling and analysis of power distribution networks in 3-D ICs,
, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Volume 21, Number 2, p.354–366, (2012)
Analysis and Optimization of Low-Power Passive Equalizers for CPU–Memory Links,
, IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume 1, Number 9, p.1406–1420, (2011)
High-speed and low-power on-chip global link using continuous-time linear equalizer,
, 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems, p.5–8, (2010)
Performance prediction of throughput-centric pipelined global interconnects with voltage scaling,
, Proceedings of the 12th ACM/IEEE international workshop on System level interconnect prediction, p.69–76, (2010)
Prediction and comparison of high-performance on-chip global interconnection,
, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, Volume 19, Number 7, p.1154–1166, (2010)
Design methodology of high performance on-chip global interconnect using terminated transmission-line,
, 2009 10th International Symposium on Quality Electronic Design, p.451–458, (2009)
On-chip global clock distribution using directional rotary traveling-wave oscillator,
, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, p.251–254, (2009)
Prediction of high-performance on-chip global interconnection,
, Proceedings of the 11th international workshop on System level interconnect prediction, p.61–68, (2009)
Low power passive equalizer design for computer memory links,
, 2008 16th IEEE Symposium on High Performance Interconnects, p.51–56, (2008)
On-chip bus signaling using passive compensation,
, 2008 IEEE-EPEP Electrical Performance of Electronic Packaging, p.33–36, (2008)
What is the design challenge for on-chip speed-of-light communication?,
, ACM SIGDA Newsletter, Volume 38, Number 14, p.1–1, (2008)